eSIM Assembly

HENGHUI provides customers with one-stop packaging solutions, covering the entire process from wafer BG and sawing, packaging, FT testing, to IoT card personalization. The company has its own high-speed tin-plating line, and the packaging workshop is certified under the IATF16949 Quality Management System, with a monthly capacity of 35 million units. Main product series include DFN, QFN, and MP2, with a focus on etched leadframe packaging, committed to providing customers with high-reliability products and first-class services.