Stock Code
301678
HENGHUI provides customers with one-stop packaging solutions, covering the entire process from wafer BG and sawing, packaging, FT testing, to IoT card personalization. The company has its own high-speed tin-plating line, and the packaging workshop is certified under the IATF16949 Quality Management System, with a monthly capacity of 35 million units. Main product series include DFN, QFN, and MP2, with a focus on etched leadframe packaging, committed to providing customers with high-reliability products and first-class services.
Research Background:
The new MP2 packaging technology is designed for industrial IoT cards (MP2). It is mainly used in harsh environments with relatively higher requirements for product reliability. However, traditional packaging technologies cannot meet the requirements , and there are problems of low production efficiency and high cost. The new MP2 packaging technology developed by HENGHUI for the industrial IoT industry has significantly improved the reliability of the packaging, fully meets the requirements of the JESD22 series standards, and greatly improves production efficiency and reduces costs, has strong mass production capabilities.
Process Comparison:
| HENGHUI New MP2 Packaging | Traditional MP2 Packaging | |
|---|---|---|
| Structure |
|
|
| Plating | Ni-Pd-Au plating, stronger corrosion resistance. | Au plating |
| Adhesion Structure | Resin one-time injection, Buckle structure, stronger adhesion. | Just adhesion between resin and substrate |
| Reliability | Fully meets the requirements of JESD22 series standards | Cannot meet the requirements of JESD22 series standards |
| Environmental Protection | Only copper and resin,more environmentally friendly. | Multi-layer resin adhesives, insulating paint surface. |
| Cost | Low packaging cost, simple process, high efficiency | Substrate mainly supplied by Japanese and European companies, high cost. Complex corresponding technology, difficult to achieve multi-layer packaging. |
Reliability Comparison:
| Test Item | HENGHUI New MP2 Packaging Technology | Traditional MP2 Packaging Technology (epoxy resin) | Traditional MP2 Packaging Technology (Industrial Plastic) |
|---|---|---|---|
|
PCT PCT (Pressure Cooker Test) |
121℃/ 100%RH/ 205Kpa, 96Hours | 121℃/100%RH/205Kpa, 24Hours | Cannot pass PCT test |
|
TCT TCT (Temperature Cycling Test) |
-65℃~ 150℃, 1,000Cycles | -45℃~ 125℃, 500Cycles | -45℃~ 85℃, 50Cycles |
|
THT THT (Temperature Humidity Test) |
85℃/85%RH, 1000Hours | 85℃/ 85%RH, 500Hours | 85℃/ 85%RH, 168Hours |
|
HTST HTST (High Temperature Storage Test) |
150℃, 1000Hours | 150℃, 500Hours | 85℃, 168Hours |
| Corrosion Resistance | In 5% NaCl environment, the card can be stored for at least 240 hours, and the operation and storage are normal | In 5% NaCl environment, the card can be stored for at least 96 hours, and the operation and storage are normal | In 5% NaCl environment, the card can be stored for at least 24 hours, and the operation and storage are normal |
Product Information:
| Item | 2FF | 3FF | 4FF |
|---|---|---|---|
| Size | 25±0.1mm*15±0.1mm | 15±0.1mm*12±0.1mm | 12.3±0.1mm*8.8±0.1mm |
| Thickness | 0.75±0.05mm | 0.65±0.05mm | |
| Plating | Ni-Pd-Au plating | ||
| Material | Epoxy resin | ||
| Pin count | 6 Pins | ||
