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        CN

        eSIM Assembly

        HENGHUI provides customers with one-stop packaging solutions, covering the entire process from wafer BG and sawing, packaging, FT testing, to IoT card personalization. The company has its own high-speed tin-plating line, and the packaging workshop is certified under the IATF16949 Quality Management System, with a monthly capacity of 35 million units. Main product series include DFN, QFN, and MP2, with a focus on etched leadframe packaging, committed to providing customers with high-reliability products and first-class services.

        Multi-Chip Packaging Products

        R&D Background:

        With the rapid development of Internet of Things (IoT) technology, various industries have increasing demands for IoT chips in terms of performance and size. To meet market demands, drive continuous improvement in chip performance, and reduce chip size, the company initiated the trial production and R&D of multi-chip, multi-wire, multi-layer wire height products starting in 2024. Currently, 2D packaging technology and 3D packaging technology have been successfully applied to various products, and related products have achieved mass production.


        Process Comparison:

        2D Packaging Technology 3D Packaging Technology
        Process Description

        A technology that arranges two or more chips side-by-side on the same plane and achieves interconnection.

        A technology that stacks two chips vertically and achieves interconnection.

        Product Image

        Advantages

        Increases integration level;

        Improves heat dissipation;

        Reduces signal delay, etc.

        ignificantly increases chip integration density;

        Effectively shortens interconnection distance between chips;

        Improves data transmission efficiency, reduces energy consumption, optimizes overall performance, etc.

        Packaging Forms

        DFN2*4-14L

        DFN3*3-12L

        QFN3*3-20L/24L

        QFN4*4-24L/32L

        MP2-4FF-A

        QFN3*4-24L

        QFN4*4-32L

        QFN5*5-40L

        QFN8*8-64L

        Wire Material

        20μm Silver Alloy Wire

        20μm Palladium-Copper Wire

        25μm Palladium-Copper Wire

        20μm Copper Wire

        18μm Palladium-Copper Wire

        20μm Palladium-Copper Wire

        25μm Palladium-Copper Wire


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