Stock Code
301678
HENGHUI provides customers with one-stop packaging solutions, covering the entire process from wafer BG and sawing, packaging, FT testing, to IoT card personalization. The company has its own high-speed tin-plating line, and the packaging workshop is certified under the IATF16949 Quality Management System, with a monthly capacity of 35 million units. Main product series include DFN, QFN, and MP2, with a focus on etched leadframe packaging, committed to providing customers with high-reliability products and first-class services.
| Product name | Size | Wire type | Application area | Moisture Sensitivity Level (MSL) | Example image |
|---|---|---|---|---|---|
| DFN4L(2.0*2.0-1.54) | 2.0*2.0*0.75 e=1.54 | Agcu | Driver protection chip |
MSL3 |
|
| DFN6L(3.0*2.3-0.80) | 3.0*2.3*0.55 e=0.80 | Agcu | IOT chip | MSL1 |
|
| DFN8L(5.0*6.0-1.27) | 5.0*6.0*0.75 e=1.27 | Agcu/PPF | IOT chip | MSL1/MSL3 |
|
| DFN8L(3.0*.3.0-0.65） | 3.0*3.0*0.75 e=0.65 | Agcu/PPF | IOT chip | MSL3 |
|
| DFN8L(2.0*2.0-0.50) | 2.0*2.0*0.75 e=0.50 | Agcu/PPF | IOT chip | MSL1/MSL3 |
|
| DFN8L(2.4*2.6-0.50) | 2.4*2.6*0.55 e=0.50 | Agcu | IOT chip | MSL3 |
|
| DFN8L(2.0*3.0-0.50) | 2.0*3.0*0.55 e=0.50 | Agcu | IOT chip | MSL3 |
|
| DFN8L(4.0*4.2-1.0) | 4.0*4.2*0.55 e=1.0 | Agcu | IOT chip | MSL3 |
|
| DFN10L(3.0*3.0-0.50) | 3.0*3.0*0.75 e=0.50 | Agcu | IOT chip | MSL3 |
|
| DFN10L(2.0*-2.5-0.40） | 2.0*2.5*0.75 e=0.40 | Agcu | IOT chip | MSL3 |
|
| DFN12L(3.0*3.0-0.45) | 3.0*3.0*0.75 e=0.45 | Agcu | IOT chip | MSL3 |
|
| DFN12L(4.0*4.9-0.65) | 4.0*4.9*0.75 e=0.65 | Agcu | IOT chip | MSL3 |
|
Next： QFN Module
