For products with high reliability requirements, surface roughening treatment is performed on the lead frame to enhance the bonding strength between the lead frame and the encapsulant, thereby meeting the reliability requirements of the enc...

HENGHUI's EAP Automation Control System is fully independently developed. It is used to control semiconductor manufacturing equipment for automated production and realizes in-depth integration from enterprise management to equipment control...

This product uses special materials to fully shield the internal structure. The material has excellent light absorption performance, capable of absorbing up to 99.5% of visible light and more than 95% of invisible near-infrared light. While...

It is the first in China to adopt conductive materials to realize Flip Chip products. Through direct interconnection between chip micro-bumps and tapes, it replaces traditional wire bonding and achieves significant breakthroughs in key perf...

HENGHUI's AVI Machine is fully independently developed. Based on deep learning of product defects, it realizes automatic detection of product defects. Currently, it has been fully applied in the production of smart card tapes and modules, g...