Technology Introduction:

It is the first in China to adopt conductive materials to realize Flip Chip products. Through direct interconnection between chip micro-bumps and tapes, it replaces traditional wire bonding and achieves significant breakthroughs in key performances. Flip Chip technology is suitable for high-end fields such as financial payment, Internet of Things security, and electronic documents, providing customers with more options.

Core Advantages:

1、Independent R&D of Tape
Adopts PTH (Plated Through Hole) technology to accurately guide the circuits on the contact surface to the chip contact positions, realizing high-density interconnection, improving packaging efficiency and reliability, effectively reducing customers' production costs, and meeting the needs of high-performance semiconductor packaging.

2、Comprehensive Improvement of Performance and Reliability
Electrical Performance: The interconnection path is shortened by 99%, effectively reducing signal loss and electromagnetic interference.
Mechanical Strength: The seismic resistance and bending life of the integrated structure are increased by more than 4 times.
Environmental Adaptability: The aging test of the operating temperature range meets JEDEC standards.

3、Significant Mass Production Efficiency
Adopts a fully automatic precision mounting process, ensuring strong product consistency, reducing inter-process circulation, shortening the processing cycle, and greatly improving delivery efficiency.

4、Further Upgraded Security
The chip circuit is completely embedded in the package, effectively preventing physical detection and providing hardware-level protection for high-security applications.

5、Environment Friendly
It does not require the use of precious metal bonding wires, encapsulants, and other materials, further reducing carbon emissions. It complies with policies such as the "Carbon Border Adjustment Mechanism" of the EU and other economies, avoiding high tariffs on exported products and maintaining international market access.