HENGHUI R&D Center serves as the company's core innovation engine, operating under an efficient "One Central Hub + Multi-Domain Branches" structure for technology development.

The R&D Center oversees strategic planning and resource coordination, unifying specialized R&D branches across product technology, production equipment, and software systems to form a cross-domain collaborative network.

Under the Center's direction, branch teams focus on breakthroughs in core technologies:

• Product R&D Team: Develops new material processes
• Equipment R&D Team: Designs intelligent manufacturing devices

• Software Team: Builds digital systems for smart factories

Collectively addressing full-chain technical challenges.

Current R&D Framework Covers Four Key Areas:

1. Basic Technology ResearchLaser/electron beam patterning, electrochemistry/material chemistry, metal/polymer bonding materials, metal surface treatment, software, and automated control systems.

2. Key Technology BreakthroughsCorrosion resistance, metal wear resistance, novel material bonding, vacuum etching, chip flip-chip bonding, via hole/electrical conduction, machine learning/image recognition, post-plating etching, laser/electron beam exposure.

3. Innovative Product DevelopmentRoll-to-roll flip-chip modules, palladium-gold electroplated carrier tapes, biometric recognition cards, conductive ceramic carriers, dual-interface coupling carriers, epoxy cloth alternatives, high-resolution photosensitive materials, cost-performance substitute materials.

4. Smart Production SystemsFull-process digital production management, automated product inspection, IoT remote chip programming, plant-wide material monitoring, and automated inventory systems.

Achievements Under This Framework:

• 50+ patents filed, including 48 invention patents (＞90% of total)
• 20+ software copyrights obtained
• Innovations span electrical testing, cutting-edge hardware/software, and automated smart factory construction, demonstrating the high efficiency of our integrated R&D model.